On March 20, 2024, the U.S. Department of Commerce and Intel Corporation announced a preliminary memorandum of terms under which Intel will receive approximately $8.5 billion in direct funding under the CHIPS and Science Act. Funding will help advance Intel’s critical semiconductor manufacturing and research and development projects at sites in Arizona, New Mexico, Ohio and Oregon – U.S. locations where the company produces some of the world’s most advanced chips and semiconductor packaging technologies.
CHIPS Act funding aims to increase U.S. semiconductor manufacturing and research and development capabilities, especially in leading-edge semiconductors.
Intel is the only American company that both designs and manufactures leading-edge logic chips. The company’s strategy is centered on three core elements – establishing process technology leadership, building a more resilient and sustainable global semiconductor supply chain, and creating a world-class foundry business – all of which align with the objectives of the CHIPS Act to bring manufacturing and technology leadership back to the United States.
Together, CHIPS Act funding and Intel’s previously announced plans to invest more than $100 billion in the U.S. over five years constitute one of the largest public-private investments ever made in the U.S. semiconductor industry.
‘It's Our Calling’: Intel, US Government Restoring Semiconductor Leadership
Watch sights and sounds from the CHIPS and Science Act event at Intel Arizona on March 20, 2024, attended by U.S. President Joe Biden, U.S. Secretary of Commerce Gina Raimondo, Intel CEO Pat Gelsinger, and other government and Intel leaders. The U.S. government granted Intel $8.5 billion in CHIPS Act funding. Gelsinger said restoring semiconductor leadership in the U.S. is “our calling.” (Credit: Intel Corporation)
News
- News Release: Intel and Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act
- Event Replay: Intel Celebrates CHIPS and Science Act Direct Funding Announcement
- Intel CEO: ‘Our goal is to have at least 50% of the world’s advanced semiconductors produced in the U.S. and Europe by the end of the decade’ (Pat Gelsinger Op-Ed in Fortune)
Event Photos
Intel CEO Pat Gelsinger sits for broadcast interviews near under-construction semiconductor factories at Intel’s Ocotillo Campus in Chandler, Arizona, on Wednesday, March 20, 2024. On that day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
Intel CEO Pat Gelsinger (left) speaks with U.S. President Joe Biden during a tour of an Intel semiconductor factory in Chandler, Arizona, on Wednesday, March 20, 2024. The tour stopped to inspect wafers representing Intel’s goal of completing five process nodes in four years. Earlier that day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
Intel CEO Pat Gelsinger (center) speaks with U.S. President Joe Biden (on his left) and U.S. Commerce Secretary Gina Raimondo (on his right) and other local leaders and Intel employees during a tour of an Intel semiconductor factory in Chandler, Arizona, on Wednesday, March 20, 2024. The tour stopped to inspect wafers representing Intel’s goal of completing five process nodes in four years. Earlier that day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
Intel CEO Pat Gelsinger (right) and U.S. Commerce Secretary Gina Raimondo hold a plaque commemorating the U.S. CHIPS and Science Act during a visit to an Intel semiconductor factory in Chandler, Arizona, on Wednesday, March 20, 2024. Earlier that day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
U.S. Commerce Secretary Gina Raimondo signs a plaque commemorating the U.S. CHIPS and Science Act during a visit to an Intel semiconductor factory in Chandler, Arizona, on Wednesday, March 20, 2024. Earlier that day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
Intel CEO Pat Gelsinger speaks Wednesday, March 20, 2024, during an event on Intel’s Ocotillo Campus in Chandler, Arizona. Earlier in the day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
Intel CEO Pat Gelsinger speaks Wednesday, March 20, 2024, during an event on Intel’s Ocotillo Campus in Chandler, Arizona. Earlier in the day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
U.S. President Joe Biden speaks Wednesday, March 20, 2024, during an event on Intel’s Ocotillo Campus in Chandler, Arizona. Earlier in the day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
U.S. President Joe Biden speaks Wednesday, March 20, 2024, during an event on Intel’s Ocotillo Campus in Chandler, Arizona. Earlier in the day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)
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Site Fact Sheets
B-Roll Video
Intel Construction, Manufacturing and Advanced Assembly Test Manufacturing across the Unites States (B-Roll)
B-roll video includes footage of construction and production at Intel manufacturing facilities across the United States. It includes footage from Intel facilities in Hillsboro, Oregon; Chandler, Arizona; Rio Rancho, New Mexico; and Licking County, Ohio. Footage includes high-volume manufacturing in Intel’s D1D and D1X factories in Oregon; Fab 42 in Arizona; and Fab 9 and Fab 11X in New Mexico. It also includes video from Intel’s advanced packaging facilities in Arizona and Oregon. (Credit: Intel Corporation)
Download video: “Intel Construction, Manufacturing and Advanced Assembly Test Manufacturing across the Unites States (B-Roll)”
- U.S. Construction and Manufacturing: Intel Construction, Manufacturing and Advanced Assembly Test Manufacturing across the Unites States (B-Roll)
- Ohio Construction: Intel Ohio Fab Construction – February 2024 (B-Roll) | Intel Ohio Fab Construction – September 2023 (B-Roll) | Intel Ohio Fab Construction – July 2023 (B-Roll)
- Arizona Construction and Manufacturing: Intel Arizona Fab 52 and Fab 62 Construction (B-Roll) | Intel Advanced Packaging with Glass Substrates (B-Roll) | Intel Fab Construction Arizona – July 2023 (B-Roll)
- New Mexico Construction and Manufacturing: Intel Advanced Packaging in New Mexico’s Fab 9, Manufacturing in Fab 11X (B-Roll)
- Oregon Manufacturing: Intel High-Volume Manufacturing in Oregon, Arizona and Ireland (B-Roll) | Manufacturing at Intel D1D/D1X (B-Roll)
- President Biden Visit to Arizona: President Joe Biden, Intel CEO Pat Gelsinger Tour Arizona Semiconductor Factory (B-Roll)
Photo Galleries
- Intel Arizona: Photo Gallery
- Intel New Mexico: Photo Gallery
- Intel Ohio: Photo Gallery
- Intel Oregon: Photo Gallery
Intel Executive Leaders
- Pat Gelsinger, chief executive officer
- David Zinsner, executive vice president and the chief financial officer
- Stuart Pann, senior vice president and general manager of Foundry Services
- Keyvan Esfarjani, executive vice president, chief global operations officer and general manager of Foundry Manufacturing and Supply Chain
- April Miller Boise, executive vice president and chief legal officer
- Christy Pambianchi, executive vice president and chief people officer
- Dr. Ann B. Kelleher, executive vice president and general manager of Foundry Technology Development
- Bruce Andrews, corporate vice president and chief government affairs officer
- Al Thompson, vice president, U.S.-Canada Government Affairs
More Context
- Intel Builds in Arizona (Press Kit)
- Intel Invests in Ohio (Press Kit)
- Intel Opens Factory Expansion in Oregon
- Intel Invests $3.5 Billion in New Mexico Operations (Press Kit)
- America’s Semiconductor Leadership Starts With Intel (Website)
- Intel is Poised to Unleash America’s Innovation Boom, Fueled by the CHIPS Act (Opinion)