Intel® Ethernet Switch FM4112
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® Ethernet Switch FM4000 Series
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Marketing Status
Discontinued
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Launch Date
Q1'08
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Expected Discontinuance
06/07/2016 (see published PCN)
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Lithography
130 nm
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TDP
27.5 W
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New Design Availability Expiration Date
Saturday, January 5, 2013
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Supplemental Information
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Description
An 8 10GbE ports and 16 1GbE ports, fully-integrated, single-chip wire-speed, layer-2/3/4, 10GbE/2.5GbE/1GbE Ethernet switch.
Networking Specifications
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Maximum Port Bandwidth
96 G
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Maximum SGMII Ports
24
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Maximum XAUI Ports
8
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Cut-Through Latency
300 ns
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Frame Processing Rate
144 M pps
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Shared Packet Memory Size
2 MB
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Traffic Classes
8
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MAC Table Size
16 K
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ACL Rules
16 K
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IPv4/IPv6 Routes
16K/4K
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Intel® FlexPipe™ Technology
No
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Advanced Load Balancing
Yes
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CEE/DCB Features
Yes
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Server Virtualization Support
Yes
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Advanced Tunneling Features
No
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Carrier Ethernet Support
No
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CPU Interface
EBI
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Applications
Data Center,FSI,HPC
Ordering and Compliance
Drivers and Software
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Latest Drivers & Software
Name
Administrative Tools for Intel® Network Adapters
Adapter User Guide for Intel® Ethernet Adapters
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.