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Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
See how Intel uses knowledge-based qualification to qualify products in unique usage environments.
See how Intel’s Corporate Quality Network (CQN) ensures only the highest-quality products go to market.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Processor insertion guide for LGA2011 socket independent loading mechanism, minimizing contact damage.