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Surface Mount Board Assembly Soldering: Guide

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Intel® Manufacturing Enabling Guide

Describes purpose of the Intel® Manufacturing Enabling Guide and provides links to chapters.

Corner Glue: Application Techniques and Materials

Reviews corner glue use as a component to reduce soldering joint strain, material selection criteria, and demonstrates proper application techniques.

Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Ball Grid Array Rework: Package-on-Package Devices

Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.

Product Development Engineering

Product Development Engineering

Intel Labs in Ireland

Intel Labs in Ireland

Technology and Manufacturing Research in Ireland

Technology and Manufacturing Research in Ireland

Factory Overview and Certification

Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.

Intel and SAP IoT Bring Actionable Insights to the Edge

Intel® IoT Gateway and sensors with SAP software provide real-time, actionable data at the edge, even without a WAN connection.

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