Paper highlights OpenStack Project, an organization focused on advancing the development of open, standards-based solutions for cloud computing.
Solution Brief: Intel, Open Data Center Alliance, and industry researchers develop an open, standards-based OpenStack* software for private and public cloud platforms, emphasizing easy implementation and large scalability.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Discusses surface mount assembly processes, preconditioning flows and moisture absorption, thermal stress, and typical chemical environments. Also covers standardized moisture sensitivity levels and handling, packing, and shipping requirements.
Datasheet: provides thermal specifications and guidelines for systems using Intel® Xeon® processor 3000 series.
Provides thermal specs, guidelines for systems using Intel® Xeon® processor 3000 series.