Intel® Core™2 Duo Mobile Processors: Thermal Design Guide
The power dissipation of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s lifecycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.
The goals of this document are to:
• Identify the thermal and mechanical specification for the device
• Describe a reference thermal solution that meets the specifications
Read the full Intel® Core™2 Duo Mobile Processors Thermal Design Guide.